In today’s electronics manufacturing landscape, where surface-mount technology (SMT) dominates, DIP reflow soldering—also known as through-hole insertion or wave soldering—remains an indispensable process for handling through-hole components (THT), particularly in high-power, high-reliability applications that demand robust physical connections. Te Yi Electronics fully recognizes the critical impact of this process on final product performance and has established a specialized, highly efficient DIP reflow soldering production line to ensure that every solder joint—from precision chips to rugged connectors—meets the highest quality standards.

We possess mature, controllable end-to-end DIP post-soldering production capabilities and implement meticulous control over key process steps.

Manual Plugin (MIP):For irregularly shaped, extra-large components that cannot be automatically inserted, experienced personnel perform operations strictly in accordance with the work instructions and conduct mutual inspections.

Automatic Plugin (AI):For standard axial and radial components, a high-precision automatic insertion machine is used to achieve efficient, consistent component placement and minimize human error.

Wave Soldering:Use a lead-free wave soldering machine.

Selective soldering:For mixed-assembly boards with DIP components in localized areas, or for PCBs where thermally sensitive regions must be protected from heat, selective soldering equipment is employed. This technology uses a fine solder wave to perform precise soldering at specific points, minimizing thermal shock and delivering exceptional accuracy—making it an advanced solution for high-density, complex board designs.

Post-processing steps:This includes automatic lead trimming, water-based or solvent-based cleaning as per customer requirements (to remove solder flux residues), and comprehensive post-soldering inspection.

Furnace temperature curve monitoring:Daily testing and recording of the furnace temperature profiles for wave soldering and selective soldering are conducted to ensure that the temperatures and dwell times during the preheating, soldering, and cooling stages fully comply with process specifications.

Solder Analysis and Management:Regular compositional analysis of the solder in the solder bath is conducted to prevent the accumulation of impurity metals that could compromise solder joint quality and ensure long-term welding stability.

Pre-plugin check:Verify the PCB version and component specifications to prevent incorrect or missing component insertion.

Process inspection:Process engineers and quality inspectors conduct routine inspections on the production line, with a particular focus on component polarity and proper insertion.

AOI testing:Three 3D AOI systems are installed before and after the furnace to automatically inspect component quality using high-resolution cameras.

Specialized Testing: Conduct In-Circuit Testing (ICT) or Functional Circuit Testing (FCT) as per customer requirements to ensure optimal electrical performance.

Supporting processes: Equipped with automatic coating machines, milling-type automatic board separation machines, and other equipment to meet the complete processing requirements of complex PCBA assemblies.

Final Quality Audit: Prior to shipment, conduct either random sampling or full inspection in accordance with customer standards and prepare a quality report.

Flexible process integration: We offer end-to-end, one-stop outsourcing services ranging from pure DIP reflow soldering to “SMT + DIP” solutions, allowing customers to choose the option that best meets their needs. We efficiently manage post-SMT rework and reflow processes, thereby shortening the overall manufacturing cycle.

Strong technical problem-solving capabilities: particularly adept at addressing the challenges of soldering high-density mixed-assembly boards and thick-copper power boards, as well as managing thermal shock for sensitive components.

Outstanding Quality Consistency: Standardized operations, parameterized equipment control, and rigorous multi-stage inspection ensure stable and reliable solder joint quality in high-volume production.

Transparent collaboration process: From design-for-manufacturability (DFM) reviews at project kickoff to issue reporting and solution coordination throughout the production process, we maintain seamless information flow, enabling customers to monitor production status in real time.

Service Types: Covering sampling, small-batch pilot production, and medium- to large-scale mass production.

Quality Commitment: We commit to delivering DIP post-soldering products with a first-pass yield (throughput rate) that is among the industry’s highest.

Delivery Commitment: Adhere strictly to the delivery schedule stipulated in the contract and maintain rapid response capabilities.

If your products involve high-power, high-reliability interconnections or hybrid technology assembly, TEYI Electronics’ DIP post-soldering service provides a robust and reliable manufacturing solution. Please feel free to contact us at any time for detailed technical solutions and quotations.

Let our expert welding expertise forge robust connections for your products!